This book describes the use of free air cooling to improve the efficiency of, and cooling of, equ...

This critical volume provides an in-depth presentation of copper wire bonding technologies, proce...

The book comprehensively covers the various aspects of risk modeling and analysis in technologica...

The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure tha...

The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilitie...

The explosive growth of the Japanese electronics industry continues to be driven by a combination...

This practical guide presents and compares the fundamental theories and techniques of placement a...

This book raises the level of understanding of thermal design criteria. It provides the design te...

Achieving cost-effective performance over time requires an organized, disciplined, and time-phase...

This practical guide presents and compares the fundamental theories and techniques of placement a...

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding...

This is an excellent text detailing situations the professional will encounter in practice. The b...