These are the proceedings of the First International Conference on Compu- tional Logic (CL 2000) ...

Solders have given the designer of modern consumer, commercial, and military electronic systems a...

In this volume, phenomenologists from the West join hands with specialists from mainland China an...

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the...

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with ...

The book focuses on the design, materials, process, fabrication, and reliability of advanced semi...

Preparation is key to success in every stage of life, and retirement is no exception. Whether it'...

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles...

The book focuses on the design, materials, process, fabrication, and reliability of chiplet desig...

An in-depth exploration of research, theory and practice of the weel being children and adolescen...

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, ...

The Mechanics of Solder Alloy Interconnects is a resourceto be used in developing a solder join...